Resonac : Participates in a US-based Leading-edge Semiconductor Consortium as The First Japanese Strategic Material Manufacturing Partner~ Conduct R&D alongside major U.S. semiconductor companies ~ -November 21, 2023 at 10:22 pm EST
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Official press release from RESONAC HOLDING CORPORATION
November 21, 2023 at 10:22 pm EST
November 22, 2023
Resonac Holdings Corporation
Resonac Corporation (President: Hidehito Takahashi) will take part in a consortium of semiconductor-related manufacturers named “Texas Institute for Electronics” (hereinafter “TIE”), which is located in the state of Texas, USA. Resonac will be the first Japanese member of TIE as a semiconductor material manufacturer.
TIE is a non-profit organization led by The University of Texas at Austin, and consists of the public and private sectors including the state of Texas, semiconductor manufacturers, defense electronics manufacturers, national laboratories, and academic bodies. Its aim is to advance the roadmap of cutting-edge semiconductor systems by five years (or more than two generations), and to develop them in the United States.. TIE’s strategic member companies include leading semiconductor manufacturers such as AMD, Inc., Micron Technology, Inc., Intel Corporation, Applied Materials, Inc., etc.*
Resonac was invited to participate as the strategic member from the materials manufacturers, as we were recognized by TIE for our comprehensive lineup of materials for the front-end and back-end processes used in advanced semiconductors, our R&D organization specializing in semiconductor packaging “Packaging Solution Center,” and our track record in operating the consortium “JOINT2” composed of semiconductor-related companies. TIE plans to launch a prototype line for wafer-scale 2xD and 3D advanced packaging starting from the second half of 2024.
Semiconductors support the lives of the people as social infrastructure. Development of leading-edge semiconductors to be used for AI and next-generation telecommunication requires cooperation between manufacturers of devices, materials, and equipment. Resonac will aim to cooperate with other companies through its participation in TIE, research and development of leading-edge technologies and contributions to solutions of problems concerning semiconductors.
Aiming to accomplish its purpose, “Change society through the power of chemistry,” Resonac will strive to promote co-creation, and contribute to improvement in semiconductors’ performance, which is needed by society.
URL of the website of Texas Institute for Electronics
- *As of end of October 2023
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Resonac Holdings Corporation published this content on 22 November 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 22 November 2023 03:21:46 UTC.
Resonac Holding Corporation (formerly Showa Denko KK) is a holding company organized around 7 family of products:
- materials (43.8% of net sales): electronics materials (epoxy molding compounds, die bonding materials, CMP slurries, anisotropic conductive films), printed wiring board materials (copper-clad laminates, photosensitive dry films), mobility components (plastic molded products, friction materials, powder metal products, carbon anode materials for LIBs), energy storage devices and systems (automotive and industrial batteries), and life sciences (diagnostics, contracted manufacturing of regenerative medicine products);
- petrochemical products (19.6%): olefins (polyethylene, polypropylene) and organic chemical products (vinyl acetate monomer, ethyl acetate and plastics);
- chemical products (12.9%): caustic soda, chlorine, liquid ammonia, amino acids, polymers, gas (oxygen, nitrogen, hydrogen), etc.;
- electronic components (8.3%): hard disks, semiconductors components, magnetic components, etc.;
- inorganic products (7.1%): ceramics and carbons (graphite electrodes);
- aluminum products (5.3%): aluminum foils, extruded products, forged products, cans, etc.;
- other (3%).
Net sales break down geographically as follows: Japan (53.4%), China (12%), Asia (20.6%) and other (14%).
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